SF230
特点
● 较低的介电损耗，插损接近LCP。
● 优秀的耐热性、尺寸稳定性、耐化学性及电性能。
● 不含卤素，阻燃性达到UL94 VTM-0级。
● 满足RoHS指令要求，不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。
应用领域
高速电路用挠性印制板和刚挠性印制板- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°) | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.36 |
| 288℃, 5s | 1.47 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Dimensional Stability | IPC-TM-650 2.2.4B |
After Etched |
% | 0.0149/-0.0360 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞95 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 201 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
1.23×109 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
4.53×106 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.2 |
| Dissipation Factor (10GHz) | SPDR |
C-24/23/50 |
- | 0.0056 |
| Folding Endurance | JIS C-6471 |
R0.8×4.9N |
Times | ＞500 |
| Flammability | UL94 | E-24/125 | Rating |
VTM-0 |
Remarks:
1.Certified to IPC-4204/11 Copper Clad Adhesiveless
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.