SF325C
特点
● 优异的耐离子迁移性，不长枝状结晶。
● 不含卤素，阻燃性达到UL94 VTM-0级。
● 粘接强度高，尺寸稳定性、耐热性好。
● 溢胶量低，加工性好，适于快速压合和传统压合。
● 满足RoHS指令要求，不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。
应用领域
挠性印制电路板用覆盖膜- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.2 |
| 288℃, 5s | 1.1 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Dimensional Stability |
SY Method |
After peeling off the paper |
% | -0.0083/-0.0021 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞90 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 100 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
8×107 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
8.5×106 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.18 |
| Dissipation Factor (10GHz) | SPDR |
C-24/23/50 |
- | 0.0125 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm | ＜0.15 |
| Flammability | UL94 | E-24/125 | Rating |
V-0 |
Remarks:
*Testing after laminating with shining side of copper foil in suitablecondition
1.Certified to IPC-4203/2 Epoxy adhesive on one or twosides of poyimide dielectric
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.