S7045GH
特点
● 高Tg＞170℃ (DSC)，无卤材料
● 低插损，Dk/Df @1GHz: 3.95/0.0095
● 更低的Z轴热膨胀系数
应用领域
● 服务器、交换机、基站和线卡- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
| Tg |
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
190 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 415 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 35 | |
| After Tg | ppm/℃ | 245 | |||
| 50-260℃ | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | ≥60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | ≥60 | |
|
Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip |
-- |
PASS |
|
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.15 | |
|
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 3.95 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0080 | |
|
IPC-TM-650 2.5.5.5 |
10GHz |
-- | 0.0095 | ||
|
Peel Strength (1oz copper foil) |
After thermal Stress 288℃,10s | N/mm | 1.0 | ||
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
Remarks:
Remarks:
1. Meet IPC-4101/130 specification sheet.
2. All the typical value is based on the 0.76mm (6*2116)specimen, but not guarantee data.
3. All the typical values listed above are for yourreference only and not intended for specification. Please contact ShengyiTechnology Co., Ltd. for detailed information. All rights from this data sheetare reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning,D=Immersion conditioning in distilled water, E=Temperature conditioning. Thefirst digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.