Synamic 6N
特点
● 高Tg 205℃ (DMA)● 低Dk/Df
● 更优异的耐热性，Td＞400℃，T300＞60min
● 更低的Z轴热膨胀系数，优异的通孔可靠性
● 更低的吸水率，优异的耐湿耐热性
● 无铅制程兼容
应用领域
● 超高速网络设备
● 服务器、交换机、存储、路由器、基站BBU等
● 高性能计算机
● 高频测量仪器等
● 光通信产品
- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 205 |
| 2.4.25D |
DSC |
185 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 402 |
|
T288 |
2.4.24.1 | TMA | min | 120 |
| T300 |
2.4.24.1 |
TMA |
min |
60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 50 |
| After Tg | ppm/℃ | 210 | ||
| 50-260℃ | % | 2.0 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.41 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 3.35 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 3.52 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0013 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 0.0021 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 0.0026 | |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.82 [4.68] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.10 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
1. All the typical value is based on the 0.76mm (6*2116) thickness specimen.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.